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Spring 2005 Symposium and Workshop: The Post-Telecommunication Boom

MEMS Alliance Spring 2005 Workshop

The Post Telecommunication Boom
18-19 April 2005

April 18th

10:00 – 4:00 MEMSCAP sponsored MUMPs® User Group Meeting
all MEMS ALLIANCE attendees welcome, Lunch is included
• Why Standard Processes?
• Technical Overview of MUMPs®
• Presentation of MUMPs Reference Material
• MUMPs-PLUS: Semi-Custom Processing

4:00-7:00 MEMS ALLIANCE MID ATLANTIC Reception and Poster Session (registration open)

April 19th

8:30-8:45 Greetings and Welcome

8:45 – 9:30 (Keynote) “MEMS and the Telcon Bubble,” Dr. Richard Payne: Vice President of Engineering and Manufacturing,

9:30-10-15 (Invited) “MEMS in Wireless Applications,” Dr. David Nagel, George Washington University,

10:15-10:30 Break

10:30-10:55 “A MEMS Capacitive Shunt Switch with a Finite Ground”, Dr. Jeyasingh Nithianandam, Morgan State University

10:55-11:20 “A MEMS Electron Gun with Carbon Nanotube Emitters”, Dr. Brian Jamieson, NASA GSFC

11:20-11:45 “Multi- and Single-layer Structure network adaptable and CMOS compatible SAW Sensor: Characterization and
simulations”, F. Hassani and M. Rahaman, The George Washington University

11:45-12:30 (Invited) “Interactions of light with nanostructured MEMS for physical sensing,” Dr. Dustin Carr, Sandia National

12:30-1:30 Lunch

1:30-2:15 (Invited) “Probing the Micro World”, Dr. Beth Pruitt, Stanford University

2:15-3:00 (Invited) “MEMS – new paradigm in research labs: from Biology to Materials Science,” Dr. Taher Saif, University of

3:00-3:50 Poster Session

3:50-4:15 “Design and Characterization of CMOS Surface Acoustic Wave Resonator: with telecommunication and sensor
applications,” Anis Nurashikin Nordin, The George Washington University

4:15-4:40 “Microfabrication of Ultra-Sensitive Quartz Crystal Microbalance (QCM) Using Inductively Coupled Plasma
Reactive Ion Etching (ICP-RIE) for Sensor Applications”, A. Goyal, Penn State University

4:40-5:05 “MEMS Nanopositioning Mechanisms: Design and Experimental Characterization”, Jason J. Gorman, National
Institute of Standards and Technology

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